Custom EMG electrodes translate an OEM differential sensing layout into a repeatable printed and converted construction. JASPER can control paired or multi-site electrode spacing, reference geometry, printed traces, dielectric, flexible tail, connector, backing, project-specified adhesive or hydrogel zones, liner, die cut, and package. Placement, motion conditions, acquisition electronics, algorithms, and finished-device validation remain with the OEM.
For paired and multi-site EMG constructions, center spacing and orientation can be as important to the OEM design as the individual contact size. The circuit drawing should therefore release the complete relative geometry rather than isolated pad diameters.
JASPER can verify printed and converted features to agreed methods. The OEM evaluates placement, skin preparation, motion, cable forces, acquisition electronics, filtering, algorithms, intended use, and any clinical or regulatory claims.
Release relative positions and mechanical handoff before choosing inspection fixtures.
Dimension contact size, center distance, orientation, symmetry, tolerance, and placement datum.
If it is missingThe two sites are individually correct but their differential geometry does not match the OEM design.
Release reference position, route, contact opening, channel identity, and connector assignment.
If it is missingThe reference path is shifted, mislabeled, or connected to the wrong interface.
Define traces, widths, clearances, insulation, bend regions, resistance, continuity, isolation, and registration.
If it is missingMovement or conversion exposes conductors or changes the approved electrical path.
Control tail exit, conductor order, reinforcement, connector, cable, strain direction, mating part, and retention.
If it is missingThe interface loads the patch or changes channel order during installation.
Map backing, adhesive or hydrogel, foam or nonwoven, contact openings, flexible zones, liner, and edge margins.
If it is missingConverted layers change contact exposure, flexibility, or the intended relative geometry.
Define center spacing, site position, channel map, electrical method, attachment, liner, label, count, and package support.
If it is missingThe array is deformed or channel identity is lost after inspection.
Values must come from the OEM acquisition and use design, not from a generic electrode label.
| Decision | Options to Review | Release Question |
|---|---|---|
| Sensing layout | Two-site differential pair, multi-site strip, reference site, center spacing, orientation, landmarks, and placement datum | Which relative geometry is functionally controlled? |
| Printed circuit | Ink, substrate, traces, contact openings, dielectric, guards, resistance, continuity, isolation, and flex zones | What electrical acceptance applies per route? |
| Interconnect | Printed tail, flexible cable, connector, pin map, reinforcement, bend keep-out, strain relief, and mating part | How does the OEM connect without loading the sensing geometry? |
| Converted stack | Backing, adhesive or hydrogel zones, foam or nonwoven, liner, labels, edge margin, and handling tab | Which materials and zones are included in supply? |
| Mechanical acceptance | Center spacing, outline, openings, tail exit, layer overlap, registration, flexibility, and package support | Which dimensions require fixture or vision evidence? |
| Electrical and lot evidence | Continuity, resistance method, isolation, channel map, attachment, appearance, label, count, and traceability | Which checks prove manufacture without implying signal performance? |
A fixture should locate the same datum used by the OEM placement method and verify site centers, reference position, tail exit, and orientation together. Checking each contact independently can miss the spacing error that matters to the acquisition layout.
Tail reinforcement, connector attachment, foam, backing overlaps, adhesive-free zones, dielectric, and packaging supports can create stiffness transitions. The OEM should identify areas where the patch must flex, while JASPER controls the released layer geometry.
Define paired or multi-site positions, reference site, spacing, orientation, placement datum, and OEM validation.
Release traces, dielectric, tail order, connector map, bend zones, and electrical acceptance.
Name substrate, backing, adhesive or hydrogel zones, reinforcement, liner, labels, and die cut.
Review spacing, registration, channel map, electrical checks, flexibility, attachment, liner, and packaging.
Lock artwork, materials, connector, fixtures, records, package, substitutions, and requalification triggers.
Check circuit artwork, print registration, die-cut datum, converted-layer alignment, fixture, stretch, and package support.
Compare site label, printed route, tail conductor, connector pin map, cable, test fixture, and revision.
Review substrate, trace transition, dielectric, reinforcement overlap, connector attachment, bend keep-out, and packaging.
Separate site geometry and circuit evidence from placement, motion, cable load, acquisition electronics, filtering, algorithm, and use validation.
Paired or multi-site printed layouts matched to a released acquisition interface.
Flexible site arrays integrated with OEM electronics and motion-validation plans.
Custom electrode geometry manufactured to an OEM-defined sensing architecture and use boundary.
Printed muscle-sensing layouts used with customer-owned electronics, filtering, and interpretation.
Custom site spacing and flexible routing for controlled research hardware.
Small builds used to compare spacing, connector, material stack, flexibility, and packaging.
The RFQ should make paired-site geometry, reference position, tail routing, and OEM validation ownership explicit.
Yes, when the site geometry, spacing, reference route, printed circuit, tail, connector, converted materials, electrical tests, registration, and packaging are released.
Yes. Its position, contact opening, channel route, connector assignment, material zones, and electrical acceptance must be controlled in the same circuit map.
No. JASPER can inspect the supplied geometry and circuit to agreed methods. Placement, motion, cable forces, electronics, filtering, algorithms, intended use, clinical outcomes, and finished-device validation remain with the OEM.
The project can define a common datum, center-to-center dimensions, orientation, tolerance, vision or fixture method, sampling plan, and record format.
Yes, with released materials, conductor order, reinforcement, bend zones, connector, pin map, attachment, retention, mating part, and inspection.
Use the general array route for denser or non-EMG channel geometry.
Review Route
Review component lands, strain management, and broader wearable patch integration.
Review Route
JASPER can review the printed circuit, converted stack, tail, connector, registration, electrical inspection, packaging, traceability, and change-control boundary.
Share the project basics. JASPER will review the stack, materials, connector, quantity, and production risks.
