Custom printed electrode arrays are the broad route for OEM and research projects whose site map does not fit a standard patch label. JASPER can manufacture application-specific electrode sites, conductive traces, dielectric or insulation zones, flexible substrates, tails, connector lands, reinforcement, project-defined converted layers, die cutting, labels, packaging, and agreed inspection. The customer owns the electrical function, use conditions, system behavior, safety, clinical or research conclusions, and regulatory validation.
Geometry from your circuitsite map, traces, dielectric, reference features, tail, connector lands, and datums
Flexible converting optionssubstrate, backing, adhesive zones, reinforcement, liner, lamination, die cut, and package
Acceptance by projectdimensions, continuity, resistance method, isolation, registration, interface, and traceability
Use This Route When Printed Electrode Geometry Is the Primary Product
A custom array may support sensing, stimulation research, contact measurement, human-machine interaction, laboratory instrumentation, or another OEM-defined purpose. The route name does not assign a medical claim; the released circuit and responsibility matrix define the supply.
JASPER can review printability, layer registration, flexible interconnect, converting, and inspection. The customer must define functional electrical limits, mating electronics, installation, use conditions, data or actuation interpretation, safety, and any clinical or regulatory pathway.
Custom Printed Electrode Arrays fit when:
the application requires a custom site map, reference geometry, trace route, dielectric, tail, or connector interface
the functional conductor can be produced with printed circuit methods on a flexible substrate
converted layers, die cuts, reinforcement, labels, packaging, and inspection can be defined by project
the customer owns functional, system, use, safety, clinical or research, and regulatory validation
Six Controls Turn a Custom Site Map into a Manufacturable Array
Start with the electrical artwork, then close the material and mechanical conversion around it.
01
Electrode-site map
Release control
Release every site, size, shape, coordinate, channel or function name, reference feature, orientation, and datum.
If it is missing
Manufacturing receives an image without controlled geometry or site identity.
Which electrical limits and methods are customer-released?
Interconnect
Tail, conductor pitch, connector lands, connector, pin map, reinforcement, bend zones, retention, and mating part
What state reaches the customer's electronics or fixture?
Converted construction
Backing, adhesive or hydrogel zones, foam or nonwoven, liner, labels, rigid islands, and handling features
Which layers are included and where do they start and stop?
Mechanical conversion
Outside die cut, holes, slots, windows, layer overlap, registration, tail exit, flatness, and package support
Which dimensions need fixture or vision evidence?
Evidence and ownership
Dimensions, print, continuity, resistance, isolation, interface, attachment, label, package, traceability, and customer system validation
Which checks prove the array and which remain complete-product validation?
CIRCUIT MASTER
Release Sites, Traces, Dielectric, and Tail as Editable Geometry
A raster image can communicate intent but should not become the production master. Controlled vector or circuit data makes site dimensions, trace widths, clearances, insulation openings, tail conductors, connector lands, and revision differences inspectable.
provide controlled vector or circuit artwork
name every site and connector position
define active openings separately from covered traces
retain electrical criteria with the artwork revision
CONVERTING DATUM
Register the Printed Circuit to Every Mechanical Feature
The array becomes usable only when its outside profile, holes, slots, contact openings, material zones, reinforcement, tail exit, labels, and package orientation agree with the circuit datum. Critical positions should be measurable after conversion.
identify critical site-to-feature dimensions
separate print and converting tolerances
design a fixture or vision method around shared datums
approve the packaged array in its customer-received state
Move from Printed Geometry to a Controlled OEM Handoff
01
Define function and ownership
Describe site roles, electrical interface, installation, environment, and customer-owned system, safety, use, and regulatory validation.
02
Release circuit geometry
Close sites, traces, dielectric, reference features, tail, connector lands, pin map, and electrical acceptance.
03
Release converted construction
Name substrate, backing, adhesive zones, reinforcement, liner, labels, die cut, and approved materials.
Resolve Custom Array Problems from the Released Master
01
Site map is ambiguous
Obtain controlled coordinates, dimensions, names, datums, orientation, and revision instead of tracing a screenshot.
02
Circuit and die cut do not align
Compare artwork datum, print registration, lamination, converted-layer datum, die-cut tool, fixture, and material stability.
03
Electrical results vary
Review ink and substrate lot, print thickness, cure, trace geometry, dielectric, conditioning, fixture contact, and test method.
04
Array passes but system function fails
Separate manufactured geometry and circuit evidence from installation, mating electronics, firmware, algorithm, environment, use, safety, and complete-system validation.
Where Custom Printed Electrode Arrays Fit
01
OEM sensing prototypes
Application-specific site maps and flexible interconnects for customer-owned electronics.
02
Human-machine interface research
Printed contact arrays used with controlled acquisition, interpretation, and study methods.
03
Laboratory instrumentation
Custom electrode geometry integrated with fixtures, connectors, and measurement hardware.
04
Wearable research platforms
Flexible arrays supplied to customer-defined body placement, electronics, and wear studies.
05
Stimulation research hardware
Printed conductive patterns manufactured to customer-owned output, use, and safety validation.
06
Nonstandard medical-device components
Custom circuits and converted layers produced to an OEM regulatory and device-validation plan.
RFQ PACKAGE
Send the Circuit Master, Layer Map, and Customer Acceptance Plan
The fastest review starts with controlled geometry and a clear description of the state expected at handoff.
site shapes, coordinates, spacing, channel or function names, reference features, contact openings, orientation, and datums
Can JASPER manufacture an electrode array from our custom artwork?
Yes, when the artwork provides controlled site, trace, dielectric, tail and connector geometry plus materials, dimensions, tolerances, electrical tests, converted layers, packaging, and ownership boundaries.
What file format is best for the circuit master?
Controlled vector or circuit data is preferred because site dimensions, trace widths, clearances, openings, conductor order, connector lands, and revisions remain inspectable.
Can the array include adhesive, hydrogel, backing, and liners?
Project-specified converted layers can be included with exact material, source, zone map, overlap, thickness, liner, handling, storage, packaging, inspection, and customer validation requirements.
Can JASPER help with printability review?
Yes. JASPER can flag trace density, clearances, dielectric registration, tail geometry, converting access, material overlap, and inspection feasibility while the customer retains functional and safety design ownership.
Does manufacturing inspection prove the array works in our system?
No. It can prove released dimensions, print, continuity, resistance, isolation, interface, registration, and package state. Installation, electronics, firmware, algorithms, use, safety, clinical or research conclusions, and regulatory validation remain with the customer.
