A custom EEG electrode array turns an OEM site map into one registered flexible circuit. JASPER can print the electrode sites, channel traces, reference or ground positions, dielectric zones, tail and connector lands, then convert project-specified backing, adhesive or hydrogel zones, reinforcement, liner, labels, and packaging. Placement, acquisition electronics, signal interpretation, patient use, and regulatory validation remain with the OEM.
The outside shape is only a carrier. The manufacturing master must identify every active site, channel name, reference or ground position, conductive route, dielectric opening, crossing rule, tail conductor, connector land, and registration feature.
A flexible array can simplify placement and wiring, but it does not define acceptable physiological signal performance. The OEM must release electrical acceptance and validate the array with its placement method, cable, acquisition electronics, software, and intended use.
Every channel must remain traceable from the contact opening through the flexible tail.
Release coordinates, spacing, array orientation, anatomical references, active, reference and ground sites, and placement datums.
If it is missingThe array fits physically but places a channel or reference site in the wrong location.
Define channel names, trace paths, widths, clearances, crossovers, guards, dielectric, continuity, resistance, and isolation.
If it is missingChannel identity or electrical separation is lost between the site map and connector.
Map printed contact, insulation opening, adhesive or hydrogel zone, backing, liner, and non-contact areas at every site.
If it is missingConverted layers reduce or shift the intended exposed contact geometry.
Release conductor pitch, tail outline, bend zone, reinforcement, connector, cable, pin map, keying, and mating part.
If it is missingThe array cannot connect or route without stressing conductors or changing channel order.
Control holes, slots, fiducials, edge datums, split lines, stretch limits, labels, and placement fixture references.
If it is missingSites shift relative to the OEM placement method during assembly or use preparation.
Define site position, channel continuity, resistance method, isolation, connector map, visual defects, label, lot, and packaging.
If it is missingA channel defect or revision mismatch cannot be isolated after the array is packaged.
The specification should let manufacturing and the OEM test the same channel map without interpretation.
| Boundary | Options to Review | Release Question |
|---|---|---|
| Array geometry | Site coordinates, spacing, active, reference and ground sites, orientation, landmarks, placement holes, and flexible zones | What geometry must the converted array preserve? |
| Printed circuit | Ink, substrate, traces, clearances, dielectric, contact openings, guards, resistance, continuity, and isolation | Which electrical criteria apply per channel and between channels? |
| Tail and connector | Tail width, pitch, reinforcement, bend radius, connector, pin map, cable, keying, retention, and mating part | How is channel identity preserved at the OEM interface? |
| Converted stack | Backing, adhesive or hydrogel zones, foam or nonwoven, site openings, liner, labels, and handling tabs | Which layers are included and how are they registered? |
| Placement features | Fiducials, holes, slots, split lines, edge datums, orientation marks, stretch limits, and fixture features | How will the OEM position the array repeatably? |
| Evidence and packaging | Dimensions, site position, channel map, resistance, continuity, isolation, connector check, label, pack, and traceability | Which evidence accompanies first articles and repeat lots? |
Site labels in a drawing, conductor order in a tail, and connector pin numbers must describe the same map. The circuit master should expose any shared reference, guarded region, dielectric crossing, bend zone, or routing density that affects print and inspection.
The conductive pattern can be correct while the converted array is wrong. Site openings, adhesive zones, backing, liner, holes, slots, labels, and outside profile must be dimensioned from array datums that the placement method can also use.
Define active, reference and ground sites, coordinates, orientation, placement features, and OEM validation.
Close traces, clearances, dielectric, tail order, connector pin map, and electrical acceptance.
Release substrate, contact openings, backing, adhesive or hydrogel zones, liner, labels, and reinforcement.
Review site position, channel map, electrical checks, connector, flexibility, registration, handling, and packaging.
Lock artwork, materials, connector, fixtures, records, packaging, substitutions, and requalification triggers.
Compare site labels, circuit artwork, tail conductors, connector pin map, cable, inspection fixture, and revision.
Review substrate stability, adhesive or hydrogel zone, lamination, die-cut datum, holes, slots, liner, and packaging.
Check contact opening, print thickness, trace width, dielectric overlap, connector land, attachment, conditioning, and test method.
Separate manufacturing evidence from placement, skin preparation, cable, acquisition electronics, grounding, software, environment, and clinical validation.
Flexible multi-site arrays matched to a controlled acquisition connector and placement plan.
Connected arrays intended to reduce loose wiring inside an OEM-validated device architecture.
Custom site maps and flexible routing integrated with a study-specific placement fixture.
Thin printed arrays with released flexible zones, tail, connector, and electronics handoff.
Custom carrier shapes and site spacing evaluated by the OEM for its intended population and use.
Small builds used to compare site maps, connectors, converted layers, and assembly methods.
The RFQ should allow every printed channel to be followed from its contact opening to the mating connector.
Yes, when the site map, channel routing, dielectric, tail order, connector pin map, materials, converting stack, electrical tests, registration, and packaging are released.
Yes. Their geometry, printed route, connector assignment, contact opening, material zones, and OEM electrical acceptance must be identified like any other channel.
No. JASPER manufactures the released array geometry. Placement method, anatomical relationship, acquisition electronics, signal interpretation, clinical use, and regulatory validation remain with the OEM.
Yes, with a released tail pitch, reinforcement, bend zone, connector, pin map, keying, retention, mating part, and inspection method.
The project may define contact geometry, site position, continuity, resistance to an agreed method, isolation, tail order, connector map, visual condition, and traceability without treating those checks as clinical validation.
Use the general array route for non-EEG site maps and application-specific electrical interfaces.
Review Route
Review integrated component lands, strain management, and wearable patch conversion.
Review Route
JASPER can review the site geometry, printed circuit, dielectric, converted layers, tail, connector, inspection, packaging, traceability, and change-control boundary.
Share the project basics. JASPER will review the stack, materials, connector, quantity, and production risks.
