01Scope and bill of material
ControlList every supplied cover, print, sensor, PCB or FPC, connector, window, light part, adhesive, gasket, carrier, fastener, label, and pack item.
Failure modeA needed part or process exists in the concept image but not in the released supply scope.
02Cover, print, and window
ControlControl outline, cosmetic zones, artwork, surface, clear aperture, black mask, touch icons, viewing state, and protected handling.
Failure modeThe front looks acceptable loose but conflicts with the display or enclosure after integration.
03Sensor and electronics interface
ControlRelease electrode map, controller boundary, PCB or FPC, pinout, connector, flex exit, grounding, host interface, and configuration ownership.
Failure modeThe physical connector mates while signals, tuning, or channel assignments remain incompatible.
04Bond, gasket, and carrier
ControlDefine adhesive coverage, gasket path, carrier material, datums, support, mounting, compression direction, and assembly sequence.
Failure modeStack position or local support changes touch behavior, window registration, or fit.
05Function-test boundary
ControlName visual, dimensional, continuity, touch, lighting, communication, fixture, host simulation, and excluded system tests.
Failure modeA component check is mistaken for approval of the display, software, PLC, or machine operation.
06Packaging and change control
ControlRelease protective films, trays, separators, connector protection, labels, revision identity, traceability, substitutions, and requalification triggers.
Failure modeApproved surfaces or configurations are damaged, mixed, or changed before customer integration.